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Taoxin Chuangke HK
| ： | BDN11-3CB/A01 |
|---|---|
| ： | Thermal - Heat Sinks |
| ： | CTS Thermal Management Products |
| ： | HEATSINK CPU W/ |
| ： | - |
| ： | Box |
| ： | - |
1
2.34
2.34
10
2.276
22.76
25
2.214
55.35
50
2.0912
104.56
100
1.9682
196.82
250
1.84516
461.29
500
1.78364
891.82
1000
1.59913
1599.13
5000
1.56838
7841.9
| TYPE | DESCRIPTION |
| Mfr | CTS Thermal Management Products |
| Series | BDN |
| Package | Box |
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Pin Fins |
| Length | 1.110" (28.19mm) |
| Width | 1.110" (28.19mm) |
| Diameter | - |
| Fin Height | 0.355" (9.02mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 7.20°C/W @ 400 LFM |
| Thermal Resistance @ Natural | 20.90°C/W |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Shelf Life | 24 Months |
| Base Product Number | BDN11 |
